Samsung recently released the latest DDR5 RAM solution, a technology that now enables users to have 512GB of DDR5 memory on a single memory stick. Samsung's new 512GB DDR5 memory improves on the company's layer-stacked memory packaging technology for its latest DDR4 memory modules. In the image below, you can compare the difference between Samsung's 4-layer DDR4 memory chip and 8-layer DDR5 chip, both connected using Samsung's through-hole technology on chips.
(From Samsung)
By grinding the silicon layer, Samsung has been able to reduce the thickness of the constituent die by 40% and similarly reduce the layer spacing – so these denser DDR5 integrated chipsets are actually thinner, 1.0mm and 1.2mm, respectively. Samsung will be able to make a 512GB memory module that connects 8 stacked DRAM together.
Samsung claims that its DDR5 technology is twice as fast as the previous generation, claiming speeds of up to 6400Mbps or more.
Samsung is ready to list it as offering DDR5 memory for data centers, smartphone makers and laptop makers, among others. Whether the 512GB DDR5 memory module will be introduced to the consumer market is not yet determined.